About Us | Corezzle Electronics
Generative Hardware, SiP, Edge AI & IoT Solutions
We make hardware as designable as software.
Corezzle Electronics is a System-in-Package (SiP) technology company that combines processor, memory, power management, and communication components into a single package. By reducing board designs of 100+ components to a single module, it brings hardware development that once took months down to a matter of days.
We fit complex hardware into a single package.
Corezzle Electronics is a Generative Hardware startup that designs and packages System-in-Package (SiP) modules in the semiconductor industry. Our entrepreneurial journey began in 2020; with the $150K UDHAM grant we received in June 2024, we spent a full year working on semiconductor packaging, and after that groundwork we founded Corezzle Electronics in August 2025. Today, with a six-person core team at Teknopark İstanbul, we combine processor, memory, power management, and communication components into a single package — making hardware development as fast and modular as software.
With this approach, we reduce board designs of 100+ components to a single module, bringing a development cycle that once took months down to a matter of days. Our Nar Series product family forms the foundation for an ecosystem that spans industrial automation to IoT, edge AI and image processing to defense and medical devices.
Three questions, three clear answers.
For us, the question of "why" is as decisive as the question of "how." The three compasses below stand behind every technical and commercial decision made at Corezzle.
Bringing hardware from months to days.
Taking a hardware idea into the field takes months. By combining 100+ components into a single package, we bring that process down to days — redirecting engineers' energy away from repetitive work like routing and thermal management, and toward the product itself.
To be at the heart of every system.
We want Corezzle SiP to be to hardware what a library is to software: inside every smart device, at the very center of the system. We're working to become an infrastructure supplier — designed and packaged in Türkiye, reaching from EMEA to global markets, and growing toward an $18M revenue target by 2030.
Engineering first.
We're a team that writes its own datasheets and runs its own packaging line. We take on the risk — signal integrity, power sequencing, DDR routing — so you can focus on your product. Every relationship begins not as a sale, but as a technical dialogue.
Sprouted with a grant, growing stronger through production.
Born from the combined experience of a team of entrepreneurs and engineers who have worked together for nearly a decade, Corezzle was founded after more than a year of preparation that began with the UDHAM grant — and today it is moving toward its first volume production.
- June 2024 · UDHAM GRANT
The first step, backed by $150K.
Our vision for semiconductor packaging took concrete form with the $150K UDHAM grant we received in June 2024. For a full year, we worked on our SiP design and packaging infrastructure.
- August 2025 · FOUNDING
Corezzle Electronics is founded.
After a year of preparation, we founded Corezzle at Teknopark İstanbul on August 21, 2025, with a focus on semiconductor packaging technology.
- September 2025 · INVESTMENT
Core Investment — funding round.
Core Investment came on board as our first external investor. This capital enabled us to set up our packaging infrastructure at Teknopark İstanbul and grow our core engineering team, moving the Nar Series from concept to a concrete product roadmap.
- November–December 2025 · VISIBILITY
On the Take Off and Big Bang stage.
In the last quarter of 2025, we took part in the Take Off and Big Bang programs, introducing Corezzle on Türkiye's leading entrepreneurship stages and building ties with the ecosystem.
- January 2026 · INVESTMENT
Gedik Holding · GearUp.
We received investment through GearUp, Gedik Holding's venture investment program. We're using these funds to strengthen our production infrastructure, scale our capacity, and develop new SiP-based products.
- May 2026 · FIRST ORDERS
First preorders and letters of intent.
As the Nar Series prepared for volume production, we began collecting preorders and letters of intent from leading manufacturers across a range of sectors — from healthcare and industrial electronics to the defense industry, IoT, and automation companies. This interest validated demand for our "a whole system in a single package" approach across multiple fields.
- June 2026 · TAMPERE
Expanding into the Finnish ecosystem.
At the invitation of the City of Tampere, we were among the startups selected for Experience Tampere 2026. Through the Founders & Funders program, we introduced Corezzle on the international stage — an opening that lays the groundwork for partnerships reaching into the Finnish and Nordic markets.
- May 2026 · FOLLOW-ON INVESTMENT
Our first investor increased their stake.
Our first investor increased their stake in Corezzle by exercising the one-year share-purchase option from our founding agreement. The backer who believed in us from day one choosing to acquire additional shares under that option is the strongest possible vote of confidence in our progress and growth potential.
- July 2026 · VOLUME PRODUCTION (planned)
Nar Series volume production.
We're entering the Nar Series' first volume production.