Nar Series SiP Products | Corezzle Electronics

Generative Hardware, SiP, Edge AI & IoT Solutions

NAR SERIES · SYSTEM-IN-PACKAGE PRODUCTS

An entire system in a single package.

Nar Series modules integrate the processor, memory, power management, connectivity, and sensors into a single package. Delivered as factory-tested, RF-calibrated System-in-Package (SiP) solutions under a single part number, they take board-level complexity off your hands.

WEARABLE & VOICE IoT · EDGE AI

NAR-ESP32S3R16/32

Size
21×27 mm
Power
0.6 W
Temperature
−40 / +85 °C

Features

  • Processor: ESP32-S3 · dual-core Xtensa LX7 @ 240 MHz
  • Connectivity: Wi-Fi b/g/n + BLE 5 + Mesh
  • Connectivity: 2.4 GHz Wi-Fi (802.11 b/g/n) + Bluetooth LE 5 + Mesh
  • Memory: 32 MB QSPI Flash + 16 MB Octal PSRAM
  • Power management: AXP2101 · 5× DC-DC + 6× LDO
  • Audio: ES8311 codec + ES7210 4-channel mic ADC
  • Sensors: ICM-42686-P IMU + PCF85063 RTC
  • USB: USB 2.0 OTG · JTAG · USBLC6 ESD protection
  • Battery: Single-cell Li-Ion/LiPo charging
  • Antenna: PCB PIFA / u.FL
NAR-ESP32S3R16/32
INDUSTRIAL AUTOMATION & EMBEDDED SYSTEMS

NAR-3358

Size
30×30 mm
Power
2.5 W
Temperature
-40 / +85°C

Features

  • Processor: TI Sitara AM3358 · ARM Cortex-A8 @ 1 GHz · NEON SIMD
  • Graphics / acceleration: PowerVR SGX530 3D GPU + 2× PRU-ICSS (real-time, 200 MHz)
  • Memory: 1 GB DDR3L (16-bit EMIF, 800 MT/s)
  • Storage: 4 GB eMMC 5.0 (HS200 / HS400)
  • Power management: Dual PMIC · TPS65217C (main, Li-Ion charging + 3× DC-DC + 4× LDO) + TL5209 (secondary 1.8 V analog LDO)
  • Interfaces: USB OTG, Ethernet MII, MMC / SD, GPMC, McASP, CAN, LCD, ADC
  • Board ID: 4 KB I²C EEPROM (Microchip 24LC32)
  • Clock: 24 MHz main + 32.768 kHz RTC crystal (integrated in-package)
  • Software: Yocto Linux + Android · mainline Linux + Yocto BSP
  • Package: T-SiP BGA · 30 × 30 mm · 400 balls (20 × 20, 1.27 mm pitch)
NAR-3358
CELLULAR IoT & LOCATION

NAR-9151

Size
18×18 mm
Power
0.9 W
Temperature
-40 / +85°C

Features

  • Processor: Nordic nRF9151 (Arm Cortex-M33 @ 64 MHz)
  • Cellular modem: LTE-M (Cat-M1) + NB-IoT (Cat-NB2), 3GPP Release 14, 17 bands
  • Location: GNSS L1 C/A (GPS), integrated LNA + SAW filter
  • eSIM: Integrated MFF2 form factor (GSMA RSP, OTA profile provisioning)
  • RF front end: SP4T antenna switch + single 50 Ω antenna pad
  • Power management: Integrated load switch + on-chip LDO (VIO/SIM 1.8 V)
  • Security: Arm TrustZone + CryptoCell-312 (AES, SHA-256, ECC)
  • Low power: PSM (<5 µA), eDRX, System OFF (<1 µA)
  • Interfaces: UART, SPI, I²C, 12-bit ADC, SWD
  • Software: Open-source NarRTOS, MCUboot, nRF Cloud
NAR-9151
EDGE AI & SMART DEVICES

NAR-32MP2x

Size
18×18 mm
Power
3.5 W
Temperature
-20 / +85°C

Features

  • Processor: STMicroelectronics STM32MP2
  • CPU cores: 2× Arm Cortex-A35 (up to 1.5 GHz) + 1× Arm Cortex-M33 (400 MHz)
  • AI NPU: Neural Processing Unit (1.35 TOPS)
  • GPU: 3D Graphics Processing Unit
  • Memory: DDR4
  • Power management: STPMIC2 PMIC
  • EEPROM: integrated
  • Oscillators
  • Oscillators, passive components
NAR-32MP2x
SENSING & RADAR

NAR-A121

Size
18.6×15 mm
Power
5 mW
Temperature
-40 / +85°C

Features

  • Radar sensor: Acconeer A121 — 60 GHz pulsed coherent radar (PCR)
  • Processor: STMicroelectronics STM32L431CBY6TR
  • CPU core: 1× Arm Cortex-M4F (low power)
  • Operating band: 57–64 GHz
  • Measurement range: 0.03 – 23 m (conditional*)
  • External interfaces: UART, Debug UART, I²C, CAN**, SWD, GPIO
  • Package: 30-pin castellated, 1.27 mm pitch
  • Supply: VIN 1.8 V / 3.3 V plus separate 1V8 analog rail
  • Idle consumption: 17.7 µA (hibernate) / 6.9 µA (off)
  • Crystal: 24 MHz
NAR-A121
Try first, then customize.

Try first, then customize.

With our development kits, test your idea on your own desk before mass production. Build IoT devices with the base NAR-ESP32S3 configuration; add the NAR-9151 cellular module to the board to enable LTE-M / NB-IoT and GNSS, and scale up to asset management and vehicle tracking solutions. One platform — reference design and full technical documentation included.

Comparison

Which module is right for you?

Compare the key technical specifications of the three Nar Series modules side by side. For detailed selection guidance, get in touch with our team.

FeatureIndustrial NAR-3358™Edge AI NAR-32MP2x™IoT & Wearable NAR-ESP32S3™CELLULAR IoT & LOCATION NAR-9151™
ProcessorTI Sitara AM335x · Cortex-A8STM32MP2 · 2×Cortex-A35 + Cortex-M33ESP32-S3 · Xtensa LX7Nordic nRF9151 · Arm Cortex-M33
AINoneNPU 1,35 TOPS + 3D GPUESP-NNNone
Memory1 GB DDR3L + 32 GB eMMCDDR432 MB Flash + 16 MB PSRAM1 MB Flash + 256 KB RAM
ConnectivityIndustrial I/OHigh-speed interfacesWi-Fi 4 + BLE 5 + MeshLTE-M + NB-IoT + GNSS/GPS
SIZE30×30 mm 18×18 mm21×27 mm (LGA-68)18×18 mm
Power2.5 W3.5 W0.6 WUltra-low power (PSM/eDRX)
Temperature−40 / +85 °C−20 / +85 °C −40 / +85 °C−40 / +85 °C
StatusComing soonEngineering samplesActive · in stockActive · in stock
Starting price$60 + KDV $60 + KDV$15 + KDV$45 + KDV
Custom Solutions

Need a SiP built for your requirements?

If our standard Nar Series modules aren't a perfect fit for your project, we design a custom System-in-Package (SiP) that combines the processor, memory, power, and connectivity blocks into a single package tailored to your needs. We take on the RF calibration, power-tree validation, and test burden; you go to production with a single part number.