Datasheet (1)
NAR-3358 SiP Module Datasheet
[NAR-3358]
User Manual (1)
NAR-3358 Pin Map
[NAR-3358]
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Prototype Stage · Sample Program. The NAR-3358 is currently in the prototype stage; volume production is planned for September 2026. You can submit a request for samples and an engineering kit for early evaluation. The detailed datasheet and reference design are shared upon request.
NAR-3358 is a System-in-Package module in a 30 × 30 mm T-SiP (BGA, 400 balls) package, designed for industrial automation and embedded system applications. It integrates the TI Sitara AM3358 processor (ARM® Cortex®-A8 @ 1 GHz, NEON SIMD, PowerVR SGX530 3D GPU, and 2× PRU-ICSS real-time cores), 1 GB DDR3L system memory (16-bit EMIF, 800 MT/s), 4 GB eMMC 5.0 storage, a dual power management architecture (TPS65217C main PMIC + TL5209 secondary LDO), and in-package clock sources (24 MHz main, 32.768 kHz RTC) in a single package. It meets industrial connectivity needs with USB OTG, Ethernet MII, MMC/SD, GPMC, McASP, CAN, LCD, and ADC interfaces; it supports Yocto Linux and Android, and is compatible with the mainline Linux + Yocto BSP open-source ecosystem. By consolidating dozens of discrete components into a single SiP, the NAR-3358 reduces board space and design complexity; it is optimized for edge gateway, HMI, and industrial control applications. It is offered as a standard SiP, with a project-based design service provided for custom SiP variants.
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