Corezzle Electronics
Generative Hardware, SiP, Edge AI & IoT Solutions
a single T-SiP.
The NAR-3358 combines the TI Sitara AM3358 (Cortex-A8 @ 1 GHz), 1 GB DDR3L, 4 GB eMMC, and dual PMIC in a single 30×30 mm T-SiP. Software is ready to go with mainline Linux and a Yocto BSP; hardware integration drops from weeks to days.
then customize.
Test the SiP right on your own desk with the NAR-ESP32S3R16/32 development board: ESP32-S3, 16 MB PSRAM, 32 MB flash, audio codec, IMU, and RTC in a single package. Add the NAR-9151 cellular module on top, and your board turns into a vehicle tracking device running on LTE-M / NB-IoT + GNSS. You can review the reference design and full technical documentation right away.
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under one roof.
Cleanroom, wire bonding, and PCB assembly (SMT) lines are running at full capacity. From design to packaging, from prototype to volume production — managed from a single point at Teknopark İstanbul.
- NAR-3358™ · INDUSTRIAL
- DEVELOPMENT KIT · NAR-ESP32S3R16/32™
- R&D & DESIGN
Together, we accelerate what moves the world forward.
IoT & Wearables
- Smartwatches & fitness bands
- Smart home devices
- Sensor nodes
- Asset tracking
- Battery-powered devices
- Wireless connectivity
NAR-ESP32S3 IoT SiP
A single 21 × 27 mm LGA-68 package. Wi-Fi 4 + Bluetooth 5 LE, audio codec, 6-axis IMU, and integrated power management (Li-Ion charging) in one part. For smartwatches and wearable devices.
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Try it first, then customize.
Test your idea right on your own desk with our development kits — before committing to volume production. Start with the base configuration to build IoT devices on the NAR-ESP32S3; add the NAR-9151 cellular module to the board to bring up LTE-M / NB-IoT and GNSS, and scale up to asset management and vehicle tracking solutions. One platform — reference design and full technical documentation included.
Blog Posts
One Package, 61% Smaller | Corezzle Electronics
Processor, memory, power management and communication come together in one package. A single SiP instead of more than 100 components, up to 61% board area savings and a simpler supply chain.
We Take On the Risk | Corezzle Electronics
Months Turn Into Days | Corezzle Electronics
Why Do Small-Antenna Tracking Devices Miss Their Location?
Does Hardware Development Really Have to Be This Complex?
News from Us
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Create your account; explore Nar Series SiP (System-in-Package) modules and Development Kits, get a price and track your orders from a single panel.
Wij zijn Corezzle. 我们是 Corezzle. Nous sommes Corezzle. 우리는 Corezzle입니다. Wir sind Corezzle. Biz Corezzle'ız. We are Corezzle.
Days, not months
In traditional hardware development, a design cycle that takes months drops to days with ready-to-use Nar Series SiP (System-in-Package) modules. Faster prototyping, faster time to market.
We take on the risk
Corezzle takes on the complex engineering risks — SiP design, signal integrity, power sequencing, and thermal management. High engineering costs and the risk of a re-spin are eliminated, so you can focus on your product.
One package, 61% smaller
Processor, memory, power management (PMIC), and communication components combine into a single LGA (Land Grid Array) package. One module instead of 100+ components — up to 61% board-area savings and a simplified supply chain.
Bright minds. Bright future.
The Corezzle team builds innovative technologies that move our world forward. We invite creative, passionate, and talented people to join our team. The future starts here.