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Generative Hardware
New Definition of Hardware
This packaged chip integrates the processor, memory, power management, and communication components into a single BGA package, reducing complex hardware development processes from months to just days for designers.
RedefiningHardware Design
Just like software developers build new applications using libraries, Corezzle SiP enables designers to “generate” their own hardware using modular building blocks. This approach creates a productive and scalable hardware ecosystem that accelerates the transition from prototype to mass production.
NAR-3358™
Features:
- Texas Instruments Sitara™ AM335x ARM® Cortex®-A8 Processor
- Up to 1 GB DDR3L Memory
- TPS65217C Power Management IC (PMIC)
- TL5209 Low-Noise LDO Regulator
- 4 KB EEPROM Storage
- Up to 32 GB eMMC Non-Volatile Storage
- Low-Power
- Low-Jitter MEMS Oscillator
- Passive Components (Resistors, Capacitors, etc.)
NAR-32MP2™
Features:
- STMicroelectronics STM32MP2 Processor
- DDR4 Memory
- STPMIC2 Power Management IC (PMIC)
- EEPROM Memory
- Oscillators
- Passive Components (resistors, capacitors, etc.)
- 2 × Arm® Cortex®-A35 cores (up to 1.5 GHz)
- 1 × Arm® Cortex®-M33 core (400 MHz)
- Artificial Intelligence Neural Processing Unit (NPU) – 1.35 TOPS performance
- 3D Graphics Processing Unit (GPU)
NAR-ESP32S3™
Features:
- Processor: Dual-core 32-bit Xtensa LX7 @ 240 MHz
- Co-processor: Ultra-low-power RISC-V co-processor
- Memory: 16 MB QSPI Flash + 8 MB PSRAM
- Power Management: 2 × 700 mA @ 3.3 V LDO (LDO2 automatically shuts down in deep sleep)
- USB: USB-C input, native USB + USB Serial JTAG, ESD protection
- Battery: Li-Po charging support
- Antenna: 3D high-gain antenna
Do You Have Special Needs?
We develop custom SiP solutions tailored to your project requirements. Talk to our experts and get a personalized quote.
What isCorezzle SiP?
next-generation System-in-Package technology that combines the processor, RAM, eMMC, and power management units into a single package—only 30×30 mm in size.
UsageAreas
Real-world applications powered by Corezzle SiP solutions
Everything you want to know about Corezzle
Everything you want to know about Corezzle
Corezzle is a technology company developing customized System-in-Package (SiP) solutions optimized for AI applications.
Our modules integrate essential components such as the CPU, RAM, PMIC, and eMMC into a compact 30×30 mm form factor.
System-in-Package is a high-density hardware architecture where multiple integrated circuits and components are combined into a single package.
This approach provides space efficiency, improved power management, and simplified PCB design.
Generative Hardware is a concept that accelerates hardware design using a software-like, generative approach.
Corezzle applies this by enabling developers to rapidly create SiP variants tailored to different applications.
Our modules can be used in many fields, including Industrial IoT, Edge AI, robotics, smart cameras, and wearable technologies.
Corezzle package chips are offered with different processor platforms depending on the application:
Solutions based on TI AM3358, STMicroelectronics STM32MP2, and Espressif ESP32-S3 are available.
Yes. Our SiP systems support Yocto Linux, Android, and custom embedded operating systems.
Yes. Corezzle provides full hardware customization, including system configuration, memory capacity, and connectivity options tailored to your project’s requirements.
Packaged chips can be purchased directly through the Corezzle sales channel or via authorized distributors.
Yes. Corezzle provides technical support and engineering consulting for hardware integration, software adaptation, and product development.